Production Firmware That Survives the Real World
Production firmware is more than “it works.” We emphasize robustness, clear error handling, versioning strategy, and integration readiness so your firmware survives real-world edge cases. Every line of code we write targets a single objective: reliable execution across the full operating envelope of your product, from the first power-on in the factory to years of continuous field operation.
Our firmware practice covers bare-metal and RTOS-based architectures on ARM Cortex-M, RISC-V, and vendor-specific microcontroller families. We deliver version-controlled, CI-tested source that your internal team or contract manufacturer can build, flash, and verify without tribal knowledge or undocumented workarounds.
Peripheral Drivers
Clean, well-documented drivers are the foundation of maintainable embedded firmware. We write hardware abstraction layers for ADC, DAC, SPI, I2C, UART, CAN, PWM, DMA, and GPIO peripherals with consistent initialization, configuration, read/write, and error-handling interfaces. Each driver is designed for thread safety when operating under an RTOS and uses DMA transfers wherever throughput or CPU budget demands it. Sensor integration—accelerometers, pressure transducers, temperature sensors, optical encoders—follows the same disciplined pattern: validated input ranges, timeout handling on bus transactions, and well-defined error return codes that calling code can act on without guesswork.
Bootloader Strategy
A robust bootloader is what separates products that can be maintained in the field from products that require physical intervention to recover. We design bootloader architectures with dual-bank (A/B) image storage so that a failed update never bricks the device. Firmware images are cryptographically signed using ECDSA or RSA, and the bootloader verifies the signature and CRC integrity of each image before execution. Rollback logic detects boot failures and automatically reverts to the last-known-good image. For resource-constrained targets, we implement delta (incremental) update mechanisms that reduce transfer size over low-bandwidth links. Every bootloader we deliver includes a documented memory map, update state machine, and integration guide so your manufacturing and field-support teams can manage firmware versions with confidence.
Connectivity: BLE, Wi-Fi, and LoRa
Wireless connectivity introduces protocol complexity, power budget constraints, and certification considerations that must be addressed at the firmware architecture level. For Bluetooth Low Energy, we design custom GATT profiles, optimize connection parameters and advertising intervals for your use case, and implement bonding and security modes appropriate to your threat model. Wi-Fi firmware covers station and soft-AP configuration, WPA2/WPA3 authentication, MQTT and HTTPS client integration, and power-management strategies for battery-operated devices. For long-range, low-power applications, we implement LoRa and LoRaWAN Class A/B/C stacks with optimized radio parameters (spreading factor, bandwidth, coding rate) tuned to your range and throughput requirements. In every case, the wireless stack is isolated from application logic through a well-defined interface, so protocol changes or module substitutions do not cascade through the codebase.
Manufacturing Test Firmware
Production test firmware is a separate build target that exercises every peripheral, interface, and subsystem on the board through a structured test sequence. We design test firmware that communicates pass/fail results and measured values over a serial or USB interface to your test fixture host, enabling automated go/no-go decisions on the production line. Test coverage includes GPIO continuity checks, ADC calibration verification, communication bus loopback tests, wireless transmit/receive validation, power rail measurements, and sensor response checks. Each test returns a structured result (pass, fail with measured value, or error with diagnostic code), and the complete test report is logged for traceability. The goal is to catch assembly defects at the board level before the product reaches final integration.