Structured Validation for Reliable Hardware
We support bring-up and validation with structured debug workflows, measurement discipline, and engineering documentation. Where needed, we plan for SI/PI checks and pre-compliance constraints early—so changes are cheaper.
Our testing methodology follows a structured, evidence-based approach. Every measurement is documented, every anomaly is investigated to root cause, and every recommendation is backed by data. We use calibrated instrumentation and industry-standard test methods to produce results you can trust—and that your customers and certification bodies will accept.
Signal Integrity (SI) Analysis
Signal integrity problems — ringing, overshoot, crosstalk, intersymbol interference — are the most common source of intermittent failures in high-speed digital designs. We perform time-domain and frequency-domain measurements on critical signal paths using high-bandwidth oscilloscopes (up to 8 GHz) and time-domain reflectometry (TDR) to characterize impedance discontinuities.
Our SI analysis includes:
- Eye diagram measurement on high-speed serial links (PCIe, USB, LVDS, HDMI) to quantify timing margin, voltage margin, and jitter
- Rise/fall time and overshoot measurements to verify compliance with receiver input specifications
- Crosstalk measurement between adjacent signal pairs to validate routing separation
- TDR impedance profiling to locate impedance mismatches in transmission lines, connectors, and via transitions
- Clock signal quality analysis including phase noise and period jitter
Power Integrity (PI) Verification
A stable, clean power delivery network is the foundation of reliable operation for every IC on the board. We characterize PDN performance using both static and dynamic measurements:
- DC voltage accuracy and load regulation across operating current range
- Switching regulator output ripple and noise spectral density, measured with proper probing technique (tip-and-barrel) to avoid measurement artifacts
- Transient load response — voltage excursion and recovery time when loads switch between idle and active states
- Inrush current profiling during power-up sequencing
- Power sequencing verification to confirm that voltage rails come up and shut down in the correct order with proper timing
- PDN impedance measurement using a vector network analyzer to identify resonances that could cause voltage instability
Pre-Compliance EMC Testing
Failing formal EMC compliance testing is expensive — it means redesign, re-fabrication, and weeks of lost schedule. Our pre-compliance testing identifies radiated and conducted emission issues early, while there is still time to implement cost-effective fixes. We perform:
- Radiated emissions scanning (30 MHz – 6 GHz) using calibrated antennas and a spectrum analyzer with EMI receiver functionality
- Conducted emissions measurement (150 kHz – 30 MHz) on power supply lines per CISPR 32 methods
- Near-field probing to localize emission sources on the board — identifying specific ICs, traces, or cables that are the dominant radiators
- Common-mode current measurement on cables and interconnects
- Mitigation guidance: specific filter component values, shielding placement, grounding modifications, and layout changes to address identified issues
Thermal Analysis
We use infrared thermal imaging and thermocouple measurements to characterize component temperatures under worst-case operating conditions. Our thermal analysis identifies components operating outside their rated temperature range and quantifies thermal margins. For designs with active cooling, we verify airflow effectiveness and heat sink performance.
Board-Level Debugging
When a prototype does not behave as expected, systematic debugging is essential. We apply a structured fault-isolation methodology using oscilloscopes, logic analyzers, multimeters, and JTAG/SWD debuggers to trace problems to their root cause — whether that is a layout error, a component defect, a firmware bug, or a specification misunderstanding.
What We Deliver
- Signal integrity report with annotated oscilloscope captures and eye diagrams
- Power integrity report with ripple, noise, and transient response measurements
- Pre-compliance EMC scan results with margin analysis against applicable limits
- Thermal imaging report with component temperature map and margin analysis
- Root-cause analysis reports for any anomalies discovered during testing
- Prioritized list of recommended design changes with expected impact
- Re-test verification after design modifications are implemented