From Requirements to Manufacturable Layouts
We translate electrical and mechanical requirements into manufacturable PCB layouts with signal integrity, power integrity, stack-up planning, and constraint-driven routing at the center of every decision. Each design accounts for the full scope of production concerns — copper balance, via structures, impedance targets, and fabricator capabilities — so the board you order is the board that works.
Deliverables are structured to reduce churn during prototyping and ramp. That means clean fabrication data, unambiguous assembly drawings, and documentation that your CM can act on without a follow-up call. When questions do come up, revision notes and constraint documentation give your team and ours a shared reference point.
Signal Integrity and High-Speed Routing
High-speed interfaces — DDR3/DDR4/DDR5, PCIe, USB 2.0/3.x, and Gigabit Ethernet — require disciplined length matching, impedance control, and return-path continuity. We define routing constraints at the schematic level and carry them through layout, verifying differential pair symmetry, via stub management, and reference plane integrity at each stage. Where designs combine sensitive analog front-ends with fast digital buses, we apply partitioning strategies that keep noise coupling within acceptable bounds.
Multilayer and HDI Stack-Ups
We design boards from 4-layer consumer products through 20+ layer telecommunications and computing platforms. HDI builds incorporate microvias (laser-drilled), stacked and staggered via structures, and via-in-pad with conductive fill. Stack-up proposals are developed in coordination with your fabrication house to ensure that layer counts, dielectric thicknesses, copper weights, and via structures are manufacturable at the volumes and price points you need.
Rigid-Flex and Specialty Constructions
Rigid-flex designs demand close attention to bend radius, copper fatigue in dynamic flex zones, coverlay adhesion, and stiffener placement. We produce stack-ups and fabrication notes that address flex layer construction, controlled-impedance regions across rigid-to-flex transitions, and panel-level tooling. For designs with unusual material requirements — high-Tg laminates, Rogers RF substrates, metal-core boards — we work directly with material suppliers and fabricators to confirm availability and process compatibility.
DFM, DFA, and Fabricator Coordination
Every layout goes through automated and manual design-for-manufacturing and design-for-assembly checks: acid traps, copper slivers, annular ring violations, solder mask dam widths, silkscreen legibility, and pick-and-place clearances. We resolve fabricator questions before release, so your boards are built on the first order without engineering holds or re-spins.
Design Tools
We work in Altium Designer as our primary EDA platform and also deliver in Cadence Allegro, OrCAD, and KiCad when project requirements or client toolchains call for it. Regardless of the tool, design data is released in standard, fabricator-accepted formats with verified output packages.
Key Deliverables
- Fabrication package (Gerbers / ODB++)
- Assembly drawings with polarity and process call-outs
- BOM with alternates notes and lifecycle flags
- Pick-and-place centroid data
- Stack-up notes with dielectric values and copper weights
- Impedance tables with target and simulated values
- Revision notes documenting changes from prior versions
- Bring-up checklist with power rail sequence and test points
Related Services
PCB design connects directly to several other stages of the product development process. Once your layout is released, Certification Support ensures the board meets FCC, CE, and safety requirements. Hardware Testing validates signal integrity, power integrity, and pre-compliance performance on the assembled prototype. And if you are managing an existing product, our Obsolescence Assessment service identifies end-of-life components before they disrupt your supply chain.